EPFL Summer@EPFL Fellowship 2027 – Eligibility, Funding, and Application Details

Overview The EPFL Summer@EPFL Fellowship 2027 is advertised as a 2–3 month research internship for international students in fields such as computer science, computer engineering, telecommunications engineering, electrical engineering, and broader engineering. The program is said to be fully funded, covering a living‑allowance and reimbursement of travel costs (train ticket or low‑cost economy return airfare). Eligibility - Academic fields: Computer Science, Computer Engineering, Telecommunications Engineering, Electrical Engineering, Engineering. - Study levels: BSc, BTech, MSc, MTech. - No explicit GPA requirement is listed. - No citizenship restrictions are mentioned. - No age limit is specified. - Language‑test requirements are not provided. Funding - An allowance for living expenses (amount not specified). - Refund of travel costs, either a train ticket or a low‑cost economy return airfare. - No tuition or housing fees are mentioned. Application Deadline - 29 November 2026 (as listed). Unknowns and Source Limitations - The exact amount of the living‑allowance is not disclosed. - Required application documents, recommendation letters, and language‑test scores are not detailed. - The source is a third‑party aggregator (scholarshipbob.com); the entry is marked as “verified” with a confidence of 80 % but no official EPFL URL is provided. - The verification status cannot guarantee accuracy; details may be outdated or incomplete. How to Proceed - Visit the listed URL for the most current information. - Contact EPFL’s Summer@EPFL office directly to confirm eligibility, funding amounts, and required documents. - Prepare a standard research‑internship application package (CV, transcript, motivation letter) in case they are required. Source: https://www.scholarshipbob.com/scholarship/epfl-summer-internship-2027-in-switzerland-fully-funded Checked: 2026-11-03T06:51:03.892652+00:00 Confirm details with the official institution before applying.